Item
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Production
Capacity
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Process Description
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Layer
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1-32 Layers
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Layer is the number of layers of the design file, and to the final announcement of the site prevails.
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Materials Type
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FR-4
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Materials Type: 94HB, 94V0, FR-4(Halogen free), Aluminum, CEM-1,Isola, Rogers, Flex, Rigid-Flex,Heavy Copper, Hybrid RF, Ceramics, High TG
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Max. PCB size
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550x1100mm
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Only allowed to receive 500x500mm, and the larger size will add extra charge,pls contact our seller for details.
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Contour tolerance
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±0.1mm
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Outline tolerance.
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PCB Thickness
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0.2--5.5mm
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Produce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0/4.0mm.
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Thickness Tolerance ( T≥1.0mm)
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± 10%
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For example, the thickness T = 1.6mm, the physical thickness is 1.44mm (T-1.6 × 10%) ~ 1.76mm (T + 1.6 × 10%).
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Min. Line Width/space
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3mil/3mil(0.75mm)
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Line width/space be possible greater than 3mil, and the minimum is not less than 3mil; for multiple layer board: both the inner and outer layer can not be less than 4mil (0.1mm).
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Outer Layer Finished Copper Thickness
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35um/210um(1OZ/6OZ)
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Refers to the thickness of the copper foil in the outer finished circuit board ,1 OZ=35um 3 OZ=105um.
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Inner Layer Finished Copper Thickness
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17um(0.5 OZ)
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Refer to the Finished Thickness of Multi Inner Layer Copper.
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Min.Drilling hole
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0.15mm(machinedrill) 0.075mm(laser drill)
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0.15mm is the min. hole , if conditions allowed we suggest to design it up to 0.3mm, aperture tolerance is ± 0.075mm.
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Drilling Acuracy(machine drill)
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±0.08mm
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The tolerance of drilling hole is 0.08mm, for example, the hole is designed to be 0.6mm, and the finished hole of the real board is qualified in the 0.52--0.68mm.
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Half Hole :Min Half Hole Diameter
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0.5mm
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Half hole process is a special process, and the min hole dia. should be bigger than 0.5mm.
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Through-hole unilateral welding ring
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≥0.1mm(4mil)
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minimum Via 4mil, minimum component hole 6mil, increase the over-hole welding ring is helpful for the over-current.
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Through-hole plug hole
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≤0.5mm
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Bigger than 0.5mm wll treat as through-hole cover oil.
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Solder Type
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Photosensitive ink
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Photosensitive ink is the most common type now. The current colors are: green, matt green, blue, red, yellow, black, matt black, white.
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BGA pad
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≥0.3mm
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BGA pad designed less than 0.3MM will cause poor welding and the finished product performance is not good.
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Solder mask Opening
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≥0.1mm
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Solder mask is often said green color, it can be done in the process of soldmask Bridge.
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Min. solder mask bridge
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≥0.075mm
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Resistance welding bridge design requires line pad spacing is bigger than 0.18mm, the thicker copper the greater spacing. If there is no remarks, do not do solder bridge.
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Min. Legend Width
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≥0.6mm
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If the minimum width of the Legend is less than 0.6mm, the actual board may not clear which caused by the design reasons.
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Min. Legend Height
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≥0.8mm
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If the minimum height of the Legend is less than 0.8mm, the actual board may not clear which caused by the design reasons.
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Legend Aspect Ratio
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1:06
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The most appropriate aspect ratio, more conducive to production.
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Space between Line and Outline
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≥0.25mm(10mil)
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If come out by Routing, the distance between the line and the line layer should not less than 0.25mm; if come out by the V cut ,the distance from the center line to the V cutting line should not be less than 0.4mm.
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Make-up: Gapless imposition
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“0”gap
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Clearance of the intermediate plate and the plate is 0.
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Panelization: Gap Requires
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1.6mm
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This clearance gap should be not less than 1.6mm, otherwise routing is very hard.
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Software support
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PADS/99SE/DXP/CAD versions/Sprint-Layout /genesis/CAM350/ /Gerber
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Support variety of the industry design software and conversion Gerber file (please remark which version your engineer used for incompatibility problem and get the notice in the FQA).
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